| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2005-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2007-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e013a9eed35833d1cd1accc769d86fc8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38ff39ee31e4dd1941c62d45cf262366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92f938c9371b233ccb87526d800d2bd8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_66c6ea75407f8031d1c2decdcb39d374 |
| publicationDate |
2007-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I276171-B |
| titleOfInvention |
Metal polishing slurry and polishing method thereof |
| abstract |
A metal polishing slurry and a polishing method thereof are provided. The slurry and the polishing method can not only achieve high Cu polishing rate and high planarization, but also reduce residual polishing particles on polished surface after polishing. The metal polishing slurry contains polishing particles and chemical components. A reaction layer, an absorption layer, or their mixed layer created by the chemical components is formed on a metal layer to be polished, i.e. the metal polishing slurry's polishing object. Electric charges generating surface potential of the polishing particles and electric charges generating surface potential of the reaction layer, the absorption layer, or their mixed layer have same polarity. |
| priorityDate |
2004-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |