http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I270981-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14627 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14643 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14638 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-469 |
| filingDate | 2005-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2007-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d13dc4c1a1614ce6875fdfeb0e40801b |
| publicationDate | 2007-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I270981-B |
| titleOfInvention | Solid-state image pickup device and manufacturing method thereof and semiconductor integrated circuit device and manufacturing method thereof |
| abstract | A method of manufacturing a solid-state image pickup device comprises a process for forming a plurality of photoelectric conversion elements PD within a semiconductor substrate 4, a process for forming an interconnection portion, having an interconnection layer 8 in an insulating layer 7, on the surface side of the semiconductor substrate 4, a process for forming an adhesive layer, made of a material cured at a temperature lower than a deterioration starting temperature of the interconnection layer 8, on the surface of the interconnection portion and bonding a supporting substrate 30 to the surface side of the interconnection portion through the adhesive layer 9 by heat treatment at a temperature lower than the deterioration starting temperature of the interconnection layer 8 and a process for decreasing a thickness of the semiconductor substrate 4 from the back side. A solid-state image pickup device manufacturing method can bond the supporting substrate 30 to the surface side of the interconnection portion through the adhesive layer 9 without exerting a thermal influence upon the interconnection layer 8 that was previously formed on the surface side of the semiconductor substrate 4. |
| priorityDate | 2004-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.