| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4069 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-70 |
| filingDate |
2005-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09fb382944bc463c53d49196cbfc7c67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_858b48a81e541c5d8342083fecc23435 |
| publicationDate |
2006-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I267941-B |
| titleOfInvention |
Element carrying board and semiconductor device using such element carrying board |
| abstract |
This invention provides an element carrying board which comprises a substrate member, a laminate of films containing a plurality of insulation layers provided on one surface of the substrate member. Among the plurality of the insulation layers, any one of the insulation layers above the second layer from the substrate member side is a photo solder resist layer containing a Cardo type polymer, and the photo solder resist layer has a thickness thinner than the thickness of an insulation resin film provided between the photo solder resist layer and the substrate member. |
| priorityDate |
2004-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |