http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I267564-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3b6e46872fdbcf5b14a3e39c711e8f97 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-42 |
| filingDate | 2004-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcbad3dfd4b4945f3e02e6d2813eb2d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed029099314e9dd152cd7b0f5781efe8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f33d4c1e3a82d324983ad9b13bb4f58 |
| publicationDate | 2006-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I267564-B |
| titleOfInvention | Electroless gold plating solution |
| abstract | This invention provides a substituted electroless gold plating solution of non-cyan system having low toxicity, being usable in the vicinity of neutral state, and having excellent adhesion of solder and coating film. The electroless gold plating solution of the invention contains a water-soluble gold compounds of non-cyan system and pyrosulfurous acid compounds. Such plating solution may further contain sulfurous acid compounds and amino carboxylic acid compounds. Pyrosulfurous acid and the alkali metals' salts, alkali earth metals, ammonium salts thereof can be used as such pyrosulfurous acid. |
| priorityDate | 2003-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.