patent/TW-I264099-B

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I264099-B

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48664 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4828 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4821 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-495
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
filingDate	2002-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2006-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92852ee110c4a2e303c8481ccbd70aa3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32e09ae2f9702dc95ffeaa3038c1b5ea
publicationDate	2006-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-I264099-B
titleOfInvention	Lead frame and manufacturing method therefor
abstract	To provide an inexpensive lead frame by suppressing the amount of palladium to be used to minimum, and to provide a method for manufacturing a lead frame having no defect. A palladium plate 1a is applied only to the surface of a metal plate 1 on which a semiconductor element is mounted and on the surface of the substrate. A formed lead, pad, other part where no mounting is required, and the side surface, are not plated.
priorityDate	2001-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558592 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23938

Total number of triples: 35.