http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I263252-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76229
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
filingDate 2005-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59563abc37c2256ede54850668f487f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb0ddf5ca15d4bbdeaff030428921e63
publicationDate 2006-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I263252-B
titleOfInvention Method for forming STI structures with controlled step height
abstract STI structures with step height control are produced using a relatively thin nitrogen-containing layer formed over a substrate. The nitrogen-containing layer may consist of SiN and SiON films with a combined thickness of 900 angstroms or less. Trench openings are formed to extend through the nitrogen-containing layer and into the substrate. Chemical vapor deposition is used to form a dielectric such as an oxide within the trench openings and over the top surface of the nitrogen-containing layer. A polishing operation is used to partially polish the CVD dielectric layer leaving a reduced thickness over the nitrogen-containing layer, and then a dry etch is used to remove the dielectric from over the nitrogen-containing layer and uniformly recede the top surface of the dielectric within the trench. Dishing effects are avoided. The nitrogen-containing layer is removed to produce STI structures with step heights of less than 500 angstroms.
priorityDate 2004-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID117630
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419556970
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558793
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23956
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419539344
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579030
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID222
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415818019
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450380722
http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID314553
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159374
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23950
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523132
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID948
http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID3885
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579069
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID416641266
http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID314553
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6326954
http://rdf.ncbi.nlm.nih.gov/pubchem/taxonomy/TAXID3885
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID947
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID452498775
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID6857397

Total number of triples: 38.