Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-007 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 |
filingDate |
2005-02-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2006-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65d7a0eb28246528b92fbef1f33fe146 |
publicationDate |
2006-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-I260715-B |
titleOfInvention |
Electroplating apparatus |
abstract |
An electroplating apparatus which is suitable for depositing a metal layer of substantially uniform thickness across the center and edge regions of a semiconductor wafer substrate is disclosed. The apparatus includes a reservoir for containing an electrolytic fluid. A cathode, to which is mounted a wafer, and an anode in the electrolytic fluid are connected to an electroplating current source. A shield is provided between the cathode and anode to facilitate a more uniform deposit of the metal onto the wafer across the entire surface, including the center and edge regions, of the wafer. |
priorityDate |
2004-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |