| abstract |
In a conventional circuit device, passive elements are soldered to mounting lands with solder as electrodes are tin plated, and therefore a single layer cross-wiring is impossible when passive elements are mounted on the circuit device. Therefore, a larger mounting area is required, the reflow temperature of the reflow process when mounting passive elements on a printed circuit board is limited, and the reliability is deteriorated due to cracking of solder after packaging. This invention provides a new circuit device in which the electrodes for passive elements are gold plated, and the bonding wires are directly press fixed to the electrodes. As a result the mounting density can be improved. Furthermore, the limitation of mounting process to be performed bellow the melting point of solder can be avoided. |