http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I259523-B

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_88fc7f9eb617072238851d46591a0c76
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 2004-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e682582c1518b1e4112379fa6c525d1a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79a2f0009a48dcbdd29a857e738c4785
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a49b51fc6c05efbfa5e72844544394d9
publicationDate 2006-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I259523-B
titleOfInvention Method for forming photoresist pattern and method for trimming photoresist pattern
abstract A method for forming a photoresist pattern is described. A photoresist layer is formed over a substrate. An exposure process and a develop process are performed to pattern the photoresist layer so as to form a patterned photoresist layer. Then, a multiple trimming process is performed to trim the patterned photoresist layer, and a final photoresist pattern is formed. Especially, the multiple trimming process comprises at least one step of an alkaline solution treatment. The method can improve profile roughness, critical dimension uniformity and critical dimension shirking of the photoresist pattern.
priorityDate 2004-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 20.