http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I257748-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8f535e8165c2cc604e4e072609e80d76 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09163 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-721 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-774 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-79 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-365 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 |
| filingDate | 2004-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e3fd86ab711c8b17bd0f5fe2a995fd5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30d6f85a7bc5d94f8c2c7c08484e08dd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4b59c6b54e254e0a42428b954cffe67 |
| publicationDate | 2006-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I257748-B |
| titleOfInvention | Connecting structure of printed wiring board |
| abstract | The present invention provides a connecting structure of printed wiring board that allows high-density packaging. A flexible printed circuit (FPC2) has an exposed conductor part (2A) including an insulated substrate (22) and a reinforcing board (24) which is laminated with the substrate (22) by means of an elastic unit (23). In the exposed conductor part (2A), multiple conductors, each having a protrusion (20) on the surface, are formed on the insulated substrate (22). The exposed conductor part (2A) can be deformed flexibly along the thickness direction of the laminated substrate(22) and reinforcing board (24). On the other hand, an inner layer board (10), a first outer layer board (11), and a second outer layer board (12) are laminated to form a printed wiring board (1), wherein the inner layer board (10) is held between the first outer layer board (11) and the second outer layer board(12). The inner layer board (10) has a grooving trench (10A) to form an inserting slot (10B) and the first outer layer has multiple through hole terminals (11A) which penetrate the side of the grooving trench (10A). When the FPC2 is inserted into the inserting slot (10B), the protrusions (20) on the FPC2 are embedded into the through hole terminals (11A) in the inserting slot (10B) for the required connection. |
| priorityDate | 2003-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.