| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
2004-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c38de5518f1e313c2d0f7115eb2314fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed222f9604abcc22f696c263471a5fad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6413736be9c034f094e97e98af16f8ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_651be83f267b64f9c8155d61c6306b6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83f76a8cce44513d4ef9bf66acb25646 |
| publicationDate |
2006-03-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I251536-B |
| titleOfInvention |
Material for multilayer printed circuit board with built-in capacitor, substrate for multilayer printed circuit board, multilayer printed circuit board and methods for producing those |
| abstract |
The present invention relates to material for a multilayer printed circuit board with built-in capacitor having a dielectric thin film having a relative dielectric constant of 10-2,000 and a thickness of 0.05-2 mum formed on a surface of a metal foil, a substrate for a multilayer printed circuit board, a multilayer printed circuit board, and methods for producing them. The present invention provides a multilayer printed circuit board with built-in capacitor which is excellent in high-density wiring and economical efficiency. |
| priorityDate |
2003-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |