| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4edd4e526605dbd18b513b4b30d19ab2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0950e9df7f0e1b73efee1bda859951ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05C13-00 |
| filingDate |
2004-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2006-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eadc22386f1df358ccf7b2395a278b2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83fa1df673f8743228573d4ce553b40b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3b66cf9df0a4c2753b8e657388e2298 |
| publicationDate |
2006-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I250566-B |
| titleOfInvention |
Coating film forming apparatus and coating film forming method |
| abstract |
The present invention targets at applying a coating liquid to the surface of a substrate by a so-called scan coating, ensuring that adjacent coating liquid lines are joined infallibly. A wafer (W) is oriented for coating so that the scan direction of a coating liquid nozzle (5) may cross any of the dicing lines (D) drawn on the wafer (W). After the coating, the wafer (W) is returned to the initial orientation and then moved out of the coating film forming apparatus. The coating film forming apparatus holds a plurality of recipes defining the coating conditions for the respective types of the wafer (W). The coating conditions defined by the recipes include the orientation of the wafer (W). According to the selected recipe, the wafer (W) is automatically oriented. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I460023-B |
| priorityDate |
2003-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |