http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I249454-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8f063b8222ec3c8e746a415e7f364473 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B7-20 |
| filingDate | 2003-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_884ce6805ffb56d42de633e61c8672ff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42cc5a9c6205f1846a2b316c15827599 |
| publicationDate | 2006-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I249454-B |
| titleOfInvention | Polishing time controlling method and apparatus for chemical mechanical polishing process |
| abstract | A polishing time controlling method for chemical mechanical polishing process is provided. First, the data of wafer cassette is detected and the pat count is acquired. Then the data and the pat count is input to the chemical mechanical polishing feedback system, and the polishing time is acquired from the chemical mechanical polishing feedback system according to the data and the pat count. At last the polishing time is output to the chemical mechanical polishing apparatus for polishing the wafer in the wafer cassette with the polishing time. |
| priorityDate | 2003-08-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.