http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I249075-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d68514a32e3a53b7a0c77aabb87304b8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2003-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2006-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_58d0a4cced11910134e648fadcb2bb3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b18ed258045ff01842c876fd6d245a5 |
| publicationDate | 2006-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I249075-B |
| titleOfInvention | Radiation-sensitive negative-type resist composition for pattern formation and pattern formation method |
| abstract | The radiation-sensitive negative-type resist composition for pattern formation containing an epoxy resin, a radiation-sensitive cationic polymerization initiator, and a solvent for dissolving the epoxy resin therein, characterized in that the resist composition, through drying, forms a resist film having a softening point falling within a range of 30 to 120 DEG C and that the epoxy resin is represented by formula (1), (wherein R1 represents a moiety derived from an organic compound having k active hydrogen atoms (k represents an integer of 1 to 100); each of n1, n2, through nk represents 0 or an integer of 1 to 100; the sum of n1, n2, through nk falls within a range of 1 to 100; and each of ""A""s, which may be identical to or different from each other, represents an oxycyclohexane skeleton represented by formula (2), (wherein X represents any of groups represented by formulas (3) to (5), and at least two groups represented by formula (3) are contained in one molecule of the epoxy resin)). |
| priorityDate | 2002-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 72.