| abstract |
A polishing composition comprises the following components (a) to (d): (a) silicon dioxide, (b) at least one alkaline substance selected from one group consisting of an inorganic salt of an alkali metal, an ammonium salt, and ethylenediamine, (c) at least one chelating agent selected from the group consisting of a compound represented by the following general formula [1] and its salt: where R1 and R2 in the general formula [1] which are the same or different, is a low carbon alkylene group, and n is an integer of from 0 to 4, and (d) water. |