| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c5520dd38cc403678d9f91e0b0ee95fb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2890003b0dc211d99557fc1c2d8d52fb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
| filingDate |
2004-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5fff26d6cf6dbe227ae307903f9d1420
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36376bad3058824ab64e0c1a727a411c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43dde4cb5f24adc487250d8d1d4b6b66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8816c89e4772a03c076f7071c8a01a88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e566a6473c73aa92c6bdcbdbdf39774 |
| publicationDate |
2005-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I244881-B |
| titleOfInvention |
Methods for forming wiring and electrode |
| abstract |
There is provided a method for forming wiring or an electrode by coating a substrate with a composition comprising (A) a complex of an amine compound and a hydrogenated aluminum compound and (B) a titanium compound or a composition comprising the complex and (C) metal particles and subjecting the obtained coating film to heating and/or a light treatment. By the method, a film can be formed that uses a conductive film forming composition with which wiring and an electrode that can be suitably used for electronic devices can be formed easily and inexpensively. |
| priorityDate |
2003-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |