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filingDate 2004-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71d14c389556d3013017b43a3e6b8445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c6073c6f501444b1c913ef6191076b7
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publicationDate 2005-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I244775-B
titleOfInvention Flip chip type nitride semiconductor light emitting device and manufacturing method thereof
abstract Disclosed herein are a flip chip type nitride semiconductor light emitting device, which comprises a substrate for growing a nitride semiconductor material, an n-type nitride semiconductor layer formed on the substrate, an active layer formed on at least a part of the n-type nitride semiconductor layer, a p-type nitride semiconductor layer formed on the active layer, a bonding force providing layer formed on the p-type nitride semiconductor layer and adapted to provide a bonding force relative to the p-type nitride semiconductor layer, a reflective electrode layer formed on the bonding force providing layer, and adapted to reflect light produced in the active layer toward the substrate and to diffuse electric current, and a cap layer formed on the reflective electrode layer, and adapted to provide a bonding force between the reflective electrode layer and a bonding metal and to reduce contact resistance.
priorityDate 2003-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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