| abstract |
In order to reduce the thickness of a semiconductor device and double its capacity, two center pad semiconductor chips stacked one on the other back to back are fixed to one face of a wiring substrate, wherein difference in the length of routing between external lands and fingers is minimized, and each of the center pads and corresponding fingers are connected via metal wires of a high conductivity. The main face of a first center pad semiconductor chip is fixed to the wiring substrate that has first and second wired faces and a through opening. The back face of the first semiconductor chip and the back face of a second semiconductor chip are fixed to each other using bonding material. The pads on each semiconductor chip are connected to corresponding fingers on the wiring substrate via metal wires. One face of the wiring substrate is sealed with a sealing resin, and on the other face, an area in the vicinity of the through opening is sealed. |