http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I242592-B

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filingDate 2001-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3913c9fb25d2e20f659036988322ae31
publicationDate 2005-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I242592-B
titleOfInvention Silicone adhesive composition
abstract To obtain a silicone adhesive composition which can be curd in a short time at a low temperature and uses a curing agent containing no halogen atom and the decomposition product of which is nontoxic and harmless. This composition comprises (A) 100 pts.wt. silicone adhesive which is a mixture or a condensate of (a) a diorganopolysiloxane represented by the formula: R12SiO-(R12R2SiO)n-SiR12R2 and (b) a polyorganosiloxane containing R13SiO0.5 units and SiO2 units in a molar ratio of R13SiO0.5 unit/SiO2 unit of 0.6-1.3 and (B) 0.5-5 pts.wt. organic peroxide curing agent represented by the formula.
priorityDate 2000-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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