| abstract |
A method and structure for a conductive bump are provided herein. A conductive surface is provided on a wafer. A conductive barrier and a conductive wetting layer, on a part of the conductive surface, have a bottom and a sidewall and further reach up a top surface. The conductive wetting and barrier layers constitute inside and outside sidewalls, respectively. A conductive seed layer overlays the conductive wetting layer and the top surface. Another conductive barrier and conductive bump are subsequently formed on the conductive seed layer. |