http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I240389-B

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filingDate 2004-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e334ae107dbeeeafe10ce79d5e8ec06
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publicationDate 2005-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I240389-B
titleOfInvention High-density layout substrate for flip-chip package
abstract A high-density layout substrate for flip-chip package is disclosed. A plurality of connecting, pads and a plurality of traces are formed on upper surface of the substrate. At least a connecting pad for flip-chip bonding is narrowed to have a short axis and a vertical long axis. The distance between the narrowed connecting pad and adjacent connecting pad is not over two third length of the short axis so that at least two of the traces can pass through the distance between narrowed connecting pad and adjacent connecting pad.
priorityDate 2004-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 23.