http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I240016-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6038f17109882ad88e9ba8ea907ebb45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-18 |
| filingDate | 2001-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c71af802d2cd07d531e5557f6765301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68c8582229a54d80d1a671c17fecde3f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_432cb5985a3e9d5c2054e6c5d330e9a9 |
| publicationDate | 2005-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I240016-B |
| titleOfInvention | Micro-etching composition for copper or copper alloy, micro-etching method and method for manufacturing printed circuit board by using the micro-etching composition |
| abstract | The invention provides a micro-etching composition which continuously treat the surface of copper or copper alloys to produce fine microscopic pits for improved adhesion to resins without producing a brown or black deposit, and a micro-etching method and a method for manufacturing printed circuit board by using the micro-etching composition. The micro-etching composition comprises a main ingredient consisting of sulfuric acid and hydrogen peroxide and an assisting ingredient consisting of phenyltetrazole and a chloride ion source. The micro-etching method comprises causing the surface of copper or copper alloy to come into contact with the micro-etching composition, thereby roughening the surface to the etching amount of 0.5-3 mum. The method for manufacturing printed circuit board comprises roughening the surfaces of inner layer circuit patterns by using the micro-etching method. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I398552-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I422711-B |
| priorityDate | 2000-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.