| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-18 |
| filingDate |
1999-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3f6f76843995339d859c61506eac5de
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5946b20043be35276f99967c26251c8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99c8ff153f13d47c917bbdd4aa659163
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6c3dfe871feb22d17dc35fa608662b0 |
| publicationDate |
2005-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I239981-B |
| titleOfInvention |
Epoxy resin compositions and semiconductor devices encapsulated therewith |
| abstract |
In an epoxy resin composition comprising an epoxy resin, a curing agent, and at least 70% by weight of an inorganic filler, at least one of the epoxy resin and the curing agent has such a molecular weight distribution as to provide an average dispersity Mw/Mn of less than 1.6, a two-nucleus compound content of less than 8% by weight and a seven- and more-nucleus compound content of less than 32% by weight. When the composition is cured at 180 DEG C for 90 seconds into a primary product having Tg1 and the primary product postcured at 180 DEG C for 5 hours into a secondary product having Tg2, the relationship: (Tg2-Tg1)/Tg2 < 0.1 is satisfied. The composition is fast-curing and effectively moldable and cures into a reliable product without a need for postcure. |
| priorityDate |
1998-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |