abstract |
A mounting method of the present invention is characterized by comprising the steps of cleaning at least the surface of the metal joint part of the first object by irradiating an energy wave or energy particle beam, and thermally bonding the cleaned metal joint part of the first object to a portion to be bonded of the second object by heating in a special gas atmosphere. In the mounting, the primary and secondary oxidations of the metal joint part can be efficiently prevented, and thereby highly reliable bonding can be carried out. |