| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0129
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10727
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A45B2200-1081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A45B2200-1018 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V33-0004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A45B3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3442 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04R17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| filingDate |
2004-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a736e6336b498423df24fe879ff2cc1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47b0eb6de57ea882a6c887a2678d9b4f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32871f8b99a1a150f4c37665cb65fd62 |
| publicationDate |
2005-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I237513-B |
| titleOfInvention |
Package of surface-mountable electronic component |
| abstract |
A package of a surface-mountable electronic component to be reflow-soldered to a circuit board at about 250 DEG C or more includes a case and a cover. The cover has a softening temperature lower than the reflow temperature, and the case has a softening temperature higher than the reflow temperature. In the package, softening the cover compensates for the stress on the bonded surfaces resulting from a difference in thermal expansion between the case and the cover caused during reflow. |
| priorityDate |
2003-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |