http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I236398-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D11-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D18-0009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D18-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00 |
| filingDate | 2001-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63db0ad9dcfec7b8569056e0c644d1b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92311969426372086f3c9b210dff5049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f002c821fb850e50b0d7912dd2ae4396 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_099cf4b00962d5d96e751f53dc918f62 |
| publicationDate | 2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I236398-B |
| titleOfInvention | Abrasive material |
| abstract | An object of the present invention is to provide a polishing body, wherein the abrasives in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case where a large quantity of the abrasives are contained. A polishing part constituting the polishing body in the invention is obtained by loading predetermined amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, alpha-methylstyrene dimer, and t-dodecyl mercaptan in an autoclave, making the mixture react for 16 hours at 75 DEG C to obtain an emulsion wherein a copolymer is dispersed, adjusting this emulsion to pH 8.5, incorporating cerium oxide powder with an average primary particle diameter of 0.3 mum and stirring to obtain an aqueous dispersion, drying this aqueous dispersion by spreading it thinly across a film, and mold pressing the dried product obtained. The above-mentioned polishing part may have a crosslinked structure. The polishing body in the invention can be used favorably in a polishing pad and the like, for polishing the surface of a semiconductor wafer or the like. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I456035-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9163314-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106795420-A |
| priorityDate | 2000-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 94.