| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f705f295f4ba571f5311e5ef1b57807 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate |
2000-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b264d70d539c532a2781268e13908be2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eda33f0f473d3590f86a61a4a81271d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a9596cf61231ca14c0c6369c74ddcc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c979eb7385c9cec24764a16d3497a2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9fafe6b9800b4abe0c88966abcff61d |
| publicationDate |
2005-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I235633-B |
| titleOfInvention |
Multi-layer printed circuit board and semiconductor device |
| abstract |
A kind of multi-layer printed circuit board is disclosed in the present invention, in which the conductor circuit and the resin insulation layer are sequentially formed on a substrate, and a solder resist layer is formed on the uppermost layer. The invention is featured with that the solder resist layer is composed of p PPO (poly phenylene oxide) resin. |
| priorityDate |
1999-08-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |