http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I234570-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fce5ff40c7ed9aa6caebe463c9d48a6c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2003-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_959e7317703b09906c49b875ed776502 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca2238899ae52c2172f2489b585f77b7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af746f6fe2c877986df80bd2243bfc51 |
| publicationDate | 2005-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I234570-B |
| titleOfInvention | Epoxy resin composition for packing optical semiconductor element |
| abstract | The present invention relates to an epoxy resin composition for packing optical semiconductor elements, which comprises (A) an epoxy resin having the following formula (I), (B) a curing agent, and (C) a curing promoter, wherein each symbols are defined in the specification. The epoxy resin composition of the present invention possesses excellent optical transmittance, UV light-resistance, no discoloring property when heating for a long period, and a low hygroscopic property. Thus the epoxy resin composition is useful for packing optical semiconductor element, especially for packing optical semiconductor element emitting blue or white light. |
| priorityDate | 2003-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 187.