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filingDate 2003-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2005-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I234226-B
titleOfInvention Method of fabricating dielectric layer
abstract Disclosed is a method of fabricating a dielectric layer, the method comprising the steps of: providing a semiconductor substrate which has been washed; forming a first nitride film by loading the substrate in a first furnace and subjecting the substrate to a first nitride treatment; forming a first oxide film by unloading the substrate having the first nitride film out of the first furnace and subjecting the substrate to a first nitride treatment by means of air introduced while the substrate is unloaded; forming a second nitride film by loading the substrate having the first oxide film in a second furnace and subjecting the substrate to a second nitride treatment; and forming a second oxide film by subjecting the top surface of the second nitride film to a second oxide treatment.
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