http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I232709-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d0693ed4f2b7b1fab97515ac2f1f311c |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2003-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f967a76df410277da591580bb4205a1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e995b5ab55ec06c11773fed93f33367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd085bc591ffdead73ecfe6af8d849c5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b5d211b2a716413c62acbedc4000dbe |
| publicationDate | 2005-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I232709-B |
| titleOfInvention | Epoxy resin material suitable for substrate of high density printed circuit board |
| abstract | The present invention provides an epoxy resin material suitable for substrate of high density printed circuit boar, having a composition including epoxy resin, hardener, and catalyst, in which both epoxy resin and hardener contain silylnorbornane group and imide group, silylnorbornane group being at least 5 wt% of the composition and imide group being at least 8 wt% of the composition. Thus, the present invention provides an epoxy resin material of high stiffness, low stress, high bonding strength, and low dielectric property, without adding stiffness enhancer, which satisfies property requirement for substrate of high density printed circuit board, and significantly reduces material costs. |
| priorityDate | 2003-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 42.