| abstract |
The present invention provides pastes for circuit connection and anisotropic conductive pastes that are excellent in storage stability and dispenser application properties, can be free of voids, bubbles and bleeding on thermo compression bonding and can give cured products having high bonding and connection reliabilities at high temperatures and high humidity, and reparability. The invention also provides methods of using these pastes. The paste for circuit connection comprises: (I) 30 to 80% by mass of an epoxy resin, (II) 10 to 50% by mass of an acid anhydride curing agent or a phenolic curing agent, and (III) 5 to 25% by mass of high-softening point fine particles. The anisotropic conductive paste comprises: (I) 30 to 80% by mass of an epoxy resin, (II) 10 to 50% by mass of an acid anhydride curing agent or a phenolic curing agent, (III) 5 to 25% by mass of high-softening point fine particles, and (IV) 0.l to 25% by mass of conductive particles. The method of using the paste for circuit connection or the anisotropic conductive paste comprises connecting an electric circuit wiring formed on a substrate with an electric circuit wiring formed on another substrate with the paste for circuit connection or the anisotropic conductive paste of the present invention. |