| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 |
| filingDate |
2001-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_887f597d0c32a0c42a5f6f736483905c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41c6c6cc81f43bc41f7b564f214ecf99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a2be733a5378a1b43857e3ce0a51b1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e013a9eed35833d1cd1accc769d86fc8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60df2bdbe95997d5a6961c5952fd207c |
| publicationDate |
2005-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I230191-B |
| titleOfInvention |
Circuit connecting adhesive with anisotropic conductivity connecting method of circuit board and circuit connecting construction by using the adhesive |
| abstract |
The present invention relates to an adhesive for connecting an anisotropic electroconductive circuits. The adhesive is interposed between two neighboring boards having opposite circuit electrodes so as to electrically connect the corresponding electrodes along the pressing direction in pressing process. Said adhesive comprises an electrode conductive particle which has been subject to a surface treatment with at least a compound selected from the group consisting of a radical polymerization compound and a basic compound or a compound having at least an epoxy group. Also disclosed are a method for connecting the circuit boards using said adhesive and a circuit connection structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8715833-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I686024-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I456018-B |
| priorityDate |
2000-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |