| abstract |
A wafer structure at least includes: a wafer having a plurality of bonding pad, a first protecting layer and a second protecting layer, wherein the bonding pads is set on the active surface, the first protecting layer is exposing the bonding pads, the second protecting layer is set on the first protecting layer and exposing the bonding pads; a adhesion layer is set on the bonding pads, and a part of adhesion layer is extension to the first protecting layer surface and covered by the second protecting layer; a barrier layer and a wettable layer are set on the adhesion layer sequentially; and a plurality of bump are set on the wettable layer. |