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filingDate 2003-06-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8ae2bf457b893a46de9794afe932bfa6
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publicationDate 2005-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I228953-B
titleOfInvention Process for creating holes in polymeric substrates
abstract Provided is a process for creating a via through a substrate including the steps of (a) providing a substantially void-free film of a curable composition; (b) applying a resist onto the curable film; (c) imaging the resist in predetermined locations; (d) developing the resist to expose predetermined areas of the curable film; (e) removing the exposed areas of the curable film to form holes through the curable film; and (f) heating the curable film of step (e) to a temperature and for a time sufficient to cure the curable composition. Also disclosed is a process of fabricating a circuit assembly which includes building patterned circuit layers upon a substrate that has vias provided by the aforementioned process.
priorityDate 2002-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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