| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0a521cfa321c963978df8ae98a84056a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00 |
| filingDate |
2002-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_058652d64d5ccc52f7a7b43daf9f5964
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb63279663654750bc25bd9f1da1860f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dba4a39b5c4f8fc4a5768c90a3b11f3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fad7a8850a49c701604ee2e9db0a49d5 |
| publicationDate |
2005-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I228132-B |
| titleOfInvention |
Soldering flux composition and solder paste |
| abstract |
Soldering flux compositions and solder pastes are provided that exhibit excellent wettability, give highly reliable solder joints, and have superior storage stability. The flux composition contains at least one compound having at least one blocked carboxyl group selected from the group including compound (X) obtained by reaction of a carboxylic acid compound and a vinyl ether compound, compound (Y) obtained by reaction of a carboxylic acid anhydride compound and a hydroxy vinyl ether compound, and compound (Z) obtained by reaction of an acid anhydride and a polyhydric alcohol, followed by addition polymerization with a divinyl ether compound, and the flux compound is non-curing. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I585152-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I755863-B |
| priorityDate |
2001-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |