http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I228024-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c6306200d61401101ee180422dd796b3 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate | 2003-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89d5c80f4021081f0aa144925adb353b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f879db1624b31720cf6676c3e8fc613d |
| publicationDate | 2005-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I228024-B |
| titleOfInvention | Method for producing tape-type flexible circuit board |
| abstract | A method for producing a tape-type flexible circuit board mainly comprises: separately installing positioning holes on pre-determined positions on the two longitudinal sides of a flexible board covered with a copper foil on the surface thereof; using the positioning holes as a basis for precision alignment in image scanning to perform an image transfer in order to form a patterned copper circuit on the copper foil layer on the flexible board; forming a patterned solder-resist layer on the surface of the flexible board formed with a copper circuit on the surface thereof; and using a die-cutting process to form equally-spaced and linearly-arranged transmission holes at pre-determined positions on the flexible board covered with the solder-resist layer on the surface thereof, thereby completing the production of a flexible circuit board with an increased production precision. |
| priorityDate | 2003-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.