http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I227939-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c2521554413e78a1085be4e110ced38d |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate | 2003-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d80013bdf9a04d6e8830e514bb69310a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9033e9f0a692379bb6d26bc4bf01d984 |
| publicationDate | 2005-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I227939-B |
| titleOfInvention | Encapsulated structure of COF (chip on film) |
| abstract | A encapsulated structure of COF (chip on film), including base membrane, a plural of metal conducting wires, chip, first metal plate, and second metal plate. The first metal plate is formed on the surface of base membrane, metal conducting wire is formed on the surface of membrane and located outside the two sides of first metal plate, and at least a metal conducting wire is electrically connected to the first metal plate. Chip has an active surface with multiple bumps thereon that bump is electrically connected to metal conducting wire to make chips allocate on the surface of membrane. The second metal plate is allocated on active surface and is at least electrically connected to one bump. The second metal plate and first metal plate form a capacitor. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620445-B1 |
| priorityDate | 2003-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.