| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e8f7e597a893f7d121001c4e8387f59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd83260a96356882b5f50dd097411a72 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate |
2000-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be0022293ddaed90696314e6c024c6e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fb9223782ea6a60240fbe78cc001c39
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_730dc2618838f5249448e1c1e2ce9120 |
| publicationDate |
2005-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I227727-B |
| titleOfInvention |
Slurry for chemical mechanical polishing |
| abstract |
In forming a damascene interconnect made of a copper-containing metal on a barrier metal film made of a tantalum-containing metal, erosion is prevented during chemical mechanical polishing of the copper-containing metal film, by using a polishing slurry comprising at least an alkanolamine represented by general formula (1): NR1m(R2OH)n, where R1 is hydrogen or alkyl having 1 to 5 carbon atoms; R2 is alkylene having 1 to 5 carbon atoms; m is an integer of 0 to 2 both inclusive; and n is a natural number of 1 to 3 both inclusive, provided that m+n is 3. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I675099-B |
| priorityDate |
1999-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |