| abstract |
An oxidized second Cu layer 14 and oxidized first Cu layer 15 are sequentially deposited on surface expect bonding pads of a second upper layer rerouting 13 made of Cu. In this manner, compared with the unoxidized second Cu layer 14 and unoxidized first Cu layer 15, the adhesive between rerouting 13 made of Cu and a package film 17 made of exposy and polyimide can be enhanced, and wet-resistant can be enhanced. |