| abstract |
The present invention provides a highly sensitive photosensitive resin composition which is possible to be alkali developed and relates to positive photosensitive resin precursor composition, which is characterised in that it comprises (a) a polymer, in which the structure unit as expressed in the general formula (1) is the main constituent in the bondings between the structure units, and (b) a photo-acid generator; in that it is possible to form a pattern with light irradiation and there after development; and in that there are total carboxyl groups of 0.02 mmol to 2.0 mmol contained per 1g said polymer; wherein R is a 3 to 8 valent organic group having at least 2 more carbon atoms, R2 is a 2 to 6 valent organic group having at least 2 more carbon atoms, R3 is hydrogen or an organic group having 1 to 20 carbon atoms; n is an integer of 3 to 100000, m is 1 or 2, p, q are integers of 0 to 4, and p+q > 0. |