http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I226114-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5a1908f384755fc487f647a70c84e147 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate | 2004-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2005-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed24f63c31e5991af558f356b4cbac26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f3ba45861ba937c12f51d308406cfd5 |
| publicationDate | 2005-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I226114-B |
| titleOfInvention | Multi chips assembling structure and method for assembling chips |
| abstract | A method for assembling chips includes the following steps. First, a first chip that includes a first passivation layer and a plurality of first pads is provided. The first passivation layer has a plurality of openings that exposes the first pads. Next, a plurality of thick lines is formed on the first passivation layer. Subsequently, a plurality of bump pads is formed on the thick lines. Furthermore, a second chip having a plurality of second pads is provided. A plurality of bumps is formed on the second pads. Finally, a heat treatment process is performed to bond the first chip and the second chip by the bonding point formed with the first bumps and the second bumps. The thickness of the thick lines could be larger than 1.8 micrometer or may comprise gold layer with thickness larger than 1 micrometer. |
| priorityDate | 2003-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 69.