http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I226096-B

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filingDate 1998-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3065e8acc199dba9499fb74aa9436aca
publicationDate 2005-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I226096-B
titleOfInvention Probe platform and method for electrically probing semiconductor wafers
abstract A system and method for a probe tile and probe platform for electrically probing a semiconductor wafer over a broad area of the semiconductor wafer. Nine ceramic tiles are configured in a flat three by three matrix, and are held in place by a probing platform. Each tile may be moved independently in an X and Y direction. The probe platform has three control knobs on the side to move a tile in the X direction and three control knobs on the front to move a tile in the Y direction. The control knobs are attached to transmission shafts which slide back and forth into three ball detent positions. The ball detent positions determine which tile is engaged and can be manipulated. The ceramic tiles hold self-aligning tungsten probe tips to permit semiconductor wafer testing over a wide temperature range.
priorityDate 1997-04-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 24.