| abstract |
A laminated substrate (10) contains a first conductive film (11), a second conductive film (12) and a third conductive film (13) in between the first conductive film (11) and the second conductive film (12). A conductive pattern layer (11A) is formed by etching the first conductive film (11). The third conductive film (13) is over-etched by using the conductive pattern (11A) as a mask, to form an anchor portion (15), where a packaging resin layer (22) is hooked so that the bonding between the packaging resin layer (22) and the conductive pattern layer (11A) is enhanced. |