| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e415f6f1eeb8706d299ea086326248bf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12708
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12493 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2001-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_354fe9a38f6d0284b590a8bcdcd99033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b0070121132aa0c1b3a6a06b16c67222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e696dad96f1120a971294f65d24dfbb5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d8dc1314a8e862f6eca542d4f211685 |
| publicationDate |
2004-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I225524-B |
| titleOfInvention |
Metal alloy compositions and plating methods related thereto |
| abstract |
The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having pi electrons that can be delocalized, e.g., an alpha, beta unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations. |
| priorityDate |
2000-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |