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filingDate 2002-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd1df37a515bf645aab98fc1c4c173bc
publicationDate 2004-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I225270-B
titleOfInvention Semiconductor device and method of formation
abstract In accordance with one embodiment of the present invention, a semiconductor device underbump metallurgy (414) is formed over a semiconductor bond pad (128), wherein the underbump metallurgy (414) comprises a chromium, copper, and nickel phased-region (404), and wherein the presence of nickel in the phased-region (404) inhibits conversion of tin from the solder bump and other tin sources from forming spallable Cu6Sn5 copper-tin intermetallics.
priorityDate 2001-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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