http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I224633-B

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bc905cbef116a1ec61d12125af9427f3
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
filingDate 2003-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2004-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef54f4fc9f8f133984be98f8eb2b386e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c51330f2fd82ee1e908df64ed59705d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4f951d589512f64f5897c78bdf483cb
publicationDate 2004-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I224633-B
titleOfInvention Surface treatment method for hot-dip galvanized steel by micro-electric-arc plasma oxidation
abstract This invention relates to a method of forming an aluminum oxide and zinc oxide plating layer on the surface of hot-dip galvanized steel by utilizing the micro-electric-arc plasma discharging deposition/oxidation. As disclosed is mainly the formation of a plating layer on the substrate of hot-dip galvanized steel which comprises aluminum oxide and zinc oxide, and the method to improve the anti-corrosion properties of the hot-dip galvanized steel. In a reactor tank, a stainless steel piece is connected to the cathode of a pulse power supply while the article to be treated is connected to the anode of the pulse power supply. This method utilizes a pulse power supply which supplies at fixed voltage and current and utilizes an electrolyte which contains 10-30 g/L of sodium aluminate and 2-20 g/L potassium hydroxide or sodium hydroxide with the addition of 5-30 g/L sodium phosphate. The pulse time and the interval time between two pulses are the same and in the range of 0.1-5.0 ms. The current density is 5-20 A/dm<2> with a peak voltage at 300-450 V for 10-60 minutes of treatment time. In addition, the article to be treated can be pre-electroplated with a polymer film. The film thickness of the plating layer by this invented method is around 10-100 mum.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112538647-A
priorityDate 2003-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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