http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I224384-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F2013-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate | 2003-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c2ab4fb4813e7b183e45a083004c0a4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_255e68ecd820d5330f57f8eca3dcfca8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eedbcdd12a66de744f8d95097a86d2cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25848581305bfab7c4376c958b39d370 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab146ec69c7efff86fcf711c46566758 |
| publicationDate | 2004-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I224384-B |
| titleOfInvention | Heat-dissipating member, manufacturing method and installation method |
| abstract | A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an inter layer comprising a metal foil and/or metal mesh having a thickness of 1 to 50 mum and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicon resin and 1,000 to 3,000 wt parts of a thermally-conducting filler formed on both surfaces of the inter layer such that the overall thickness is within the range of 40 to 500 mum. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40 to 250 DEG C and a particle diameter of 0.1 to 100 mum, together with a thermally-conducting powder (2) having a melting temperature exceeding 250 DEG C and an average particle diameter of 0.1 to 100 mum, such that (1)/[(1)+(2)]=0.2-1.0. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102782068-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102782068-A |
| priorityDate | 2002-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.