http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I224077-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0109 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-0072 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H3-007 |
| filingDate | 2002-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2004-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40c15bd63ef960f91ca01773e249083b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d942c2bb8eca3f873b09af1d88135e9 |
| publicationDate | 2004-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-I224077-B |
| titleOfInvention | Sacrificial layer technique to make gaps in MEMS applications |
| abstract | A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducing a second structural material over the sacrificial material; and removing the sacrificial material. An apparatus comprising a first structure on a substrate; and a second structure on the substrate and separated from the first structure by an unfilled gap defined by the thickness of a removed film. |
| priorityDate | 2001-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.