| abstract |
A method for mounting a passive component on a wafer. A passivation layer is formed on a wafer having at least one first metal pad and at least one second metal pad thereon, where the first and second metal pads are substantially exposed. A capping layer is formed on the exposed first metal pad and then a metal layer is blankly formed overlying the wafer. Thereafter, the metal layer is patterned to form an under bump metallurgy (UBM) layer on the second metal pad. A photoresist pattern layer is blankly formed overlying the wafer to cover the capping layer and the passivation layer and expose the UBM layer. A solder bump is formed on the exposed UBM layer. After the photoresist pattern layer and the capping layer are successively removed, a passive component is mounted overlying the wafer through the solder bump. |