| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e415f6f1eeb8706d299ea086326248bf |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-06 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-88
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-06 |
| filingDate |
2002-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2004-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71bc67bbdb600cd4a738382980d0f03e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da7ef8382024151ded15bcfce47174db
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cb3f2884a6e0d15f33399fdd736a4f9 |
| publicationDate |
2004-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I223289-B |
| titleOfInvention |
Dielectric structure, and capacitor and printed circuit board having the same and manufacturing method thereof |
| abstract |
Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers. |
| priorityDate |
2001-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |